i ntegrated c ircuits d ivision www.ixysic.com ds-PLA171-r02 1 PLA171 single-pole, normally open optomos ? relay e 3 pb part # description PLA171p 6-pin (8-pin body) flatpack (50/tube) PLA171ptr 6-pin (8-pin body) flatpack, tape & reel (1000/reel) parameter rating units load voltage 800 v p load current 100 ma rms / ma dc on-resistance (max) 50 ? input control current 2 ma applications features description ordering information pin configuration ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? automotive high-voltage circuitry ? aerospace ? industrial controls ? 7mm separation of output pins ? 800v p blocking voltage ? 5000v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? arc-free with no snubbing circuits ? no emi/rfi generation ? small surface mount package ? machine insertable, wave solderable ? flammability rating ul 94 v-0 switching characteristics of normally open devices approvals ? ul certified component: file e76270 ? en/iec 60950 certified component: tuv certificate b 10 05 49410 006 form-a i f i load 10% 90% t on t off 3 2 8 + control C control nc load load nc 5 1 4 specially designed to provide 7mm of separation between the two output pins, ixys integrated circuits division's PLA171 is a single-pole, normally open (1-form-a) solid state relay that uses optically coupled mosfet technology to provide an en hanced input-to-output isolation of 5000v rms . its optically coupled outputs, which use the patented optomos architecture, are controlled by a highly efficient gaaias infrared led. the PLA171 is designed to replace, and offers superior reliability over, electromechanical relays. this device provides bounce-free switching in a compact surface-mount package. http://www..net/ datasheet pdf - http://www..net/
i ntegrated c ircuits d ivision www.ixysic.com 2 r02 PLA171 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units blocking voltage 800 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw esd, human body model 8 kv isolation voltage, input to output (60 seconds) 5000 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc electrical characteristics @ 25oc parameter conditions symbol min typ max units output characteristics load current continuous 1 i f =2ma i l - - 100 ma rms / ma dc peak i f =2ma , t=10ms i lpk - - 350 ma p on-resistance 2 i f =2ma, i l = 100ma r on -4050 ? i f =5ma, i l =1ma - 70 85 off-state leakage current i f =0ma, v l =800v p i leak --1 a switching speeds turn-on i f =5ma, v l =10v t on - 0.42 5 ms turn-off t off - 0.15 5 output capacitance i f =0ma, v l =50v, f=1mhz c out -11- pf input characteristics input control current to activate 3 i l =100ma i f - 0.39 2 ma input control current to deactivate - i f 0.1 - - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r - - 10 a common characteristics input to output capacitance - c i/o -3- pf 1 load derates linearly from 100ma @ 25 o c to 55ma @85 o c. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (greater than 60 o c) a led drive current of 5ma is recommended. http://www..net/ datasheet pdf - http://www..net/
i ntegrated c ircuits d ivision PLA171 www.ixysic.com 3 r02 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. performance data @ 25oc (unless otherwise noted) * led forward voltage (v) 1.230 1.235 1.240 1.245 1.250 1.255 device count (n) 0 5 10 15 20 25 30 35 typical led forward voltage drop (n=50, i f =5ma) turn-on time (ms) 0.36 0.38 0.40 0.42 0.44 0.46 0.48 device count (n) 0 5 10 15 20 25 typical turn-on time (n=50, i f =5ma, i l =100ma) turn-off time (ms) 0.135 0.140 0.145 0.150 0.155 0.160 0.165 device count (n) 0 5 10 15 20 typical turn-off time (n=50, i f =5ma, i l =100ma) led current (ma) 0.33 0.35 0.37 0.39 0.41 0.43 0.45 device count (n) 0 5 10 15 typical i f for switch operation (n=50, i l =100ma) on-resistance ( : ) 40.0 40.5 41.0 41.5 42.0 42.5 device count (n) 0 5 10 15 20 25 30 35 typical on-resistance distribution (n=50, i f =2ma, i l =100ma) typical blocking voltage distribution (n=50) blocking voltage (v p ) 956 964 972 980 988 996 1004 device count (n) 0 5 10 15 http://www..net/ datasheet pdf - http://www..net/
i ntegrated c ircuits d ivision www.ixysic.com 4 r02 PLA171 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. performance data @ 25oc (unless otherwise noted) * temperature (oc) -40 -20 0 20 40 60 80 100 led voltage drop (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 typical led voltage drop vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma i f =2ma led current (ma) 0 1020304050 turn-on time (ms) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 typical turn-on time vs. led forward current (i l =55ma) led current (ma) 0 1020304050 turn-off time (ms) 0.148 0.150 0.152 0.154 0.156 0.158 0.160 typical turn-off time vs. led forward current (i l =55ma) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.35 0.40 0.45 0.50 0.55 led current to operate vs. temperature (i l =55ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time (ms) 0.3 0.4 0.5 0.6 0.7 0.8 0.9 typical turn-on time vs. temperature i f =2ma i f =5ma temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time (ms) 0.10 0.12 0.14 0.16 0.18 0.20 typical turn-off time vs. temperature i f =5ma i f =2ma temperature (oc) -40 -20 0 20 40 60 80 100 on-resistance ( : ) 20 30 40 50 60 70 typical on-resistance vs. temperature (i f =5ma) i l =30ma i l =55ma voltage (v) -6 -4 -2 0 2 4 6 load current (ma) -100 -50 0 50 100 typical load current vs. load voltage (i f =2ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (ma) 50 60 70 80 90 100 110 maximum load current vs. temperature (i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 900 920 940 960 980 1000 1020 1040 typical blocking voltage vs. temperature temperature (oc) -40 -20 0 20 40 60 80 100 leakage current (na) 10 20 30 40 50 60 70 80 typical leakage current vs. temperature (v l =800v) time 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s load current (a) 0.0 0.2 0.4 0.6 0.8 1.0 energy rating curve http://www..net/ datasheet pdf - http://www..net/
i ntegrated c ircuits d ivision PLA171 www.ixysic.com 5 r02 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating PLA171p msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time PLA171p 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb http://www..net/ datasheet pdf - http://www..net/
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com PLA171 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-PLA171-r02 ?copyright 2012, ixys integrated circuits division optomos? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 6 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 8.077 0.127 (0.318 0.005) 7.620 0.254 (0.300 0.010) 2.159 typ. (0.085 typ.) 2.286 max. (0.090 max.) 0.203 (0.008) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) recommended pcb land pattern dimensions mm (inches) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 7.62 (0.30) 2.159 0.025 (0.085 0.001) pin 1 dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157) PLA171ptr tape & reel PLA171p mechanical dimensions http://www..net/ datasheet pdf - http://www..net/
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